C8051F537-IT Silicon Laboratories Inc, C8051F537-IT Datasheet - Page 51

• Manufacturer Part Number: C8051F537-IT
• Description: IC 8051 MCU 2K FLASH 20TSSOP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F53xr

Specifications of C8051F537-IT

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 16
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.25 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 336-1401

Table 3.9. QFN-20 Landing Diagram Dimensions
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD).
4. A stainless steel, laser-cut and electro-polished stencil with
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all
7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-
Symbol
noted.
Clearance between the solder mask and the metal pad is to be
60 µm minimum, all the way around the pad.
trapezoidal walls should be used to assure good solder paste
release.
perimeter pads.
used for the center ground pad.
020 specification for Small Body Components.
C1
C2
X1
X2
Y1
Y2
E
C8051F52x/F52xA/F53x/F53xA
Rev. 1.3
3.90
3.90
0.20
2.75
0.65
2.75
Min
0.50 BSC.
Max
4.00
4.00
0.30
2.85
0.75
2.85
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