MC9S12XA512VAG Freescale Semiconductor, MC9S12XA512VAG Datasheet - Page 730

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MC9S12XA512VAG

Manufacturer Part Number
MC9S12XA512VAG
Description
IC MCU 512K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12XA512VAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
59
Number Of Timers
12
Operating Supply Voltage
0 V to 5.5 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 19 S12X Debug (S12XDBGV2) Module
When program control returns from a tagged breakpoint using an RTI or BDM GO command without
program counter modification it will return to the instruction whose tag generated the breakpoint. Thus
care must be taken to avoid re triggering a breakpoint at the same location. This can be done by
reconfiguring the DBG module in the SWI routine, (SWI configuration), or by executing a TRACE
command before the GO (BDM configuration) to increment the program flow past the tagged instruction.
Comparators should not be configured for the vector address range while tagging, since these addresses
are not opcode addresses
MC9S12XDP512 Data Sheet, Rev. 2.21
732
Freescale Semiconductor

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