ATMEGA328P-MU Atmel, ATMEGA328P-MU Datasheet - Page 31

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ATMEGA328P-MU

Manufacturer Part Number
ATMEGA328P-MU
Description
MCU AVR 32K FLASH 32-QFN
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA328P-MU

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Processor Series
ATMEGA32x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
23
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Controller Family/series
AVR MEGA
No. Of I/o's
23
Eeprom Memory Size
1KB
Ram Memory Size
2KB
Cpu Speed
20MHz
Rohs Compliant
Yes
For Use With
ATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA328P-MU
Manufacturer:
XILINX
0
Part Number:
ATMEGA328P-MU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
8271C–AVR–08/10
Figure 8-3.
Table 8-6.
Notes:
ATmega48A/48PA/88A/88PA/168A/168PA/328/328
Oscillator Source /
Power Conditions
Ceramic resonator, fast
rising power
Ceramic resonator, slowly
rising power
Ceramic resonator, BOD
enabled
Ceramic resonator, fast
rising power
Ceramic resonator, slowly
rising power
Crystal Oscillator, BOD
enabled
Crystal Oscillator, fast
rising power
Crystal Oscillator, slowly
rising power
1. These options should only be used when not operating close to the maximum frequency of the
2. These options are intended for use with ceramic resonators and will ensure frequency stability
device, and only if frequency stability at start-up is not important for the application. These
options are not suitable for crystals.
at start-up. They can also be used with crystals when not operating close to the maximum fre-
quency of the device, and if frequency stability at start-up is not important for the application.
Crystal Oscillator Connections
Start-up Times for the Full Swing Crystal Oscillator Clock Selection
Start-up Time from
Power-down and
C2
C1
Power-save
16K CK
16K CK
16K CK
258 CK
258 CK
1K CK
1K CK
1K CK
XTAL2 (TOSC2)
XTAL1 (TOSC1)
GND
Additional Delay
14CK + 4.1 ms
14CK + 4.1 ms
14CK + 65 ms
14CK + 65 ms
14CK + 4.1 ms
14CK + 65 ms
(V
from Reset
CC
14CK
14CK
= 5.0V)
(2)
(1)
(2)
(1)
(2)
CKSEL0
0
0
0
0
1
1
1
1
SUT1...0
00
01
10
11
00
01
10
11
31

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