SAK-XE162FN-40F80L AA Infineon Technologies, SAK-XE162FN-40F80L AA Datasheet - Page 25

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SAK-XE162FN-40F80L AA

Manufacturer Part Number
SAK-XE162FN-40F80L AA
Description
IC MCU 16BIT 320KB FLASH 64LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet

Specifications of SAK-XE162FN-40F80L AA

Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
320KB (320K x 8)
Program Memory Type
FLASH
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Table 5
Pin
2,
16,
18,
32,
34,
48,
50,
64
1,
17,
33,
49
Data Sheet
Symbol
V
V
DDPB
SS
Pin Definitions and Functions (cont’d)
Ctrl.
-
-
Type Function
PS/B Digital Pad Supply Voltage for Domain B
PS/-- Digital Ground
Connect decoupling capacitors to adjacent
V
Note: The on-chip voltage regulators and all ports
All
or ground-plane.
Note: Also the exposed pad is connected
DDP
V
SS
/
V
25
except P5, P6 and P15 are fed from supply
voltage
internally to
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to the
Data Sheet. Board layout examples are
given in an application note.
SS
pins must be connected to the ground-line
pin pairs as close as possible to the pins.
V
DDPB
XE166 Family / Value Line
.
V
General Device Information
SS
. To improve the EMC
XE162FN, XE162HN
V1.3, 2010-04

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