SAK-XE162FN-16F80L AA Infineon Technologies, SAK-XE162FN-16F80L AA Datasheet - Page 102

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SAK-XE162FN-16F80L AA

Manufacturer Part Number
SAK-XE162FN-16F80L AA
Description
IC MCU 16BIT 128KB FLASH 64LQFP
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet

Specifications of SAK-XE162FN-16F80L AA

Core Processor
C166SV2
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
18K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 36
Parameter
TDI/TMS hold after TCK
rising edge
TDO valid from TCK falling
edge (propagation delay)
TDO high impedance to
valid output from TCK
falling edge
TDO valid output to high
impedance from TCK
falling edge
TDO hold after TCK falling
edge
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
Figure 26
Data Sheet
0.5
1)
V
D D P
2)1)
1)
JTAG Interface Timing for Lower Voltage Range (cont’d)
Test Clock Timing (TCK)
t
2
1)
Symbol
t
t
t
t
t
t
7
8
9
10
18
1
SR
CC
CC
CC
CC
t
3
Min.
6
5
102
Values
Typ.
32
32
32
t
5
Max.
36
36
36
XE166 Family / Value Line
Unit Note /
ns
ns
ns
ns
ns
XE162FN, XE162HN
Electrical Parameters
t
4
Test Condition
MC_ JTAG_ TCK
V1.3, 2010-04
0.9
0.1
V
V
D D P
D D P

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