SAK-XC2236N-24F40L Infineon Technologies, SAK-XC2236N-24F40L Datasheet - Page 26

• Manufacturer Part Number: SAK-XC2236N-24F40L
• Description: IC MCU 16BIT FLASH 64-LQFP
• Manufacturer: Infineon Technologies
• Series: XC22xxNr

Specifications of SAK-XC2236N-24F40L

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 40
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: SP000527770

Table 6
Pin
63
6
24,
41,
57
9
2,
16,
18,
32,
34,
48,
50,
64
1,
17,
33,
49
Data Sheet
Symbol
ESR0
U1C0_DX0E
U1C0_DX2B
V
V
V
V
V
DDIM
DDI1
DDPA
DDPB
SS
Pin Definitions and Functions (cont’d)
Ctrl.
O0 / I St/B
I
I
-
-
-
-
-
Type Function
St/B
St/B
PS/M Digital Core Supply Voltage for Domain M
PS/1 Digital Core Supply Voltage for Domain 1
PS/A Digital Pad Supply Voltage for Domain A
PS/B Digital Pad Supply Voltage for Domain B
PS/-- Digital Ground
External Service Request 0
After power-up, ESR0 operates as open-drain
bidirectional reset with a weak pull-up.
USIC1 Channel 0 Shift Data Input
USIC1 Channel 0 Shift Control Input
Decouple with a ceramic capacitor, see Data
Sheet for details.
Decouple with a ceramic capacitor, see Data
Sheet for details.
All
Connect decoupling capacitors to adjacent
V
Note: The A/D_Converters and ports P5, P6 and
Connect decoupling capacitors to adjacent
V
Note: The on-chip voltage regulators and all ports
All
or ground-plane.
Note: Also the exposed pad is connected
DDP
DDP
XC2232N, XC2234N, XC2236N, XC2238N
V
V
DDI1
SS
/
/
V
V
26
P15 are fed from supply voltage
except P5, P6 and P15 are fed from supply
voltage
internally to
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to the
Data Sheet. Board layout examples are
given in an application note.
SS
SS
pins must be connected to the ground-line
pins must be connected to each other.
pin pairs as close as possible to the pins.
pin pairs as close as possible to the pins.
V
DDPB
XC2000 Family / Value Line
.
V
General Device Information
SS
. To improve the EMC
V1.3, 2010-04
V
DDPA
.