MCF5233CVM150J Freescale Semiconductor, MCF5233CVM150J Datasheet - Page 46

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MCF5233CVM150J

Manufacturer Part Number
MCF5233CVM150J
Description
IC MCU 64K SRAM 150MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF523xr
Datasheet

Specifications of MCF5233CVM150J

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
97
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Processor Series
MCF523x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5234-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5233CVM150J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Document Revision History
46
Rev. No.
1.5
1.6
1.7
1.8
2
3
4
• Removed Overview, Features, Modes of Operation, and Address Multiplexing sections. This
• Removed list of documentation table in
• Added
• Updated 196MAPBGA package dimensions,
• Removed second sentence from
• Removed third and fourth paragraphs from
• Corrected position of spec D5 in
• Added part number MCF5235CVF150 in
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
information can be found in the MCF5235 Reference Manual.
always available on our web site.
Table
Table
Table
QSPI_CS1 pin location from “—” to 139 for the 160QFP device.
Figure
ERXDV, ERXER, and
ETXEN, ETXER,
(ETXD[3:0], ETXEN, ETXER,
Section 5.2.1, “Supply Voltage Sequencing and Separation
V
Section 5.2.1, “Supply Voltage Sequencing and Separation
voltage level from 1.5V to 3.3V throughout section.
Section 5.2.1.1, “Power Up
Table
Table
DDPLL
Table 26. MCF5235EC Revision History (continued)
9: Changed core supply voltage (V
10: Changed max f
2: Changed SD_CKE pin location from 139 to “—” for the 160QFP device. Changed
14: Added DACKn and DREQn to footnote.
9, added PLL supply voltage row
Section 5.2.1, “Supply Voltage Sequencing and Separation
8: Changed pin 139 label from “SD_CKE/QSPI_CS1” to “QSPI_CS1/SD_CKE”.
to match rest of document.
ETXCLK),”
ERXCLK),”
ICO
Sequence” first bullet, changed “Use 1 µs” to “Use 1 ms”.
frequency from “75 MHz” to “150 MHz”.
regarding no minimum frequency requirement for TXCLK.
ETXCLK),”
Substantive Change(s)
Figure
and
Section 7.10.1, “MII Receive Signal Timing (ERXD[3:0],
Section 7.10.2, “MII Transmit Signal Timing (ETXD[3:0],
Section 8,
14.
DD
Table 6
as this feature is not supported on this device.
) from 1.35-1.65 to 1.4-1.6.
Section 7.10.2, “MII Transmit Signal Timing
Figure
“Documentation.”. An up-to-date list is
3.
Cautions” changed PLLV
Cautions” Changed V
Cautions.”
Freescale Semiconductor
DDPLL
DD
to

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