MCF5233CVM150J Freescale Semiconductor, MCF5233CVM150J Datasheet - Page 22

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MCF5233CVM150J

Manufacturer Part Number
MCF5233CVM150J
Description
IC MCU 64K SRAM 150MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF523xr
Datasheet

Specifications of MCF5233CVM150J

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
97
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Processor Series
MCF523x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5234-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5233CVM150J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Mechanicals/Pinouts and Part Numbers
6.4
Figure 9
22
Z
–C–
L
shows MCF5232CAB80 package dimensions.
–A–
C
Package Dimensions—160 QFP
E
Y
0.110 (0.004)
H
–H–
DETAIL C
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
0.20 (0.008)
0.20 (0.008)
0.20 (0.008)
S
W
M
L
A
M
Figure 9. 160 QFP Package Dimensions
A-B
BOTTOM
DETAIL A
C
C
TOP &
X
M
A-B
K
A-B
×
U
×
S
S
Case 864A-03
D
D
R
Q
T
S
S
×
7. DIMENSION D DOES NOT INCLUDE DAMBAR
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
NOTES
1. DIMENSIONING AND TOLERINCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLAN -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B-, AND -D- TO BE DETERMINED AT
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUM PLANE -H-.
SEATING PLANE -C-.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
–B–
DETAIL C
–H–
B
V
N
0.13 (0.005) M
B
SECTION B–B
B
DETAIL A
BASE
METAL
D
F
G
C
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
A-B
MILLIMETERS
–A–, –B–, –D–
27.90
27.90
MIN
31.00
31.00
3.35
3.35
0.22
3.20
0.22
0.65 BSC
0.25
0.11
0.70
25.35 BSC
0.11
1.60 REF
1.33 REF
1.33 REF
0.325 BSC
0.13
0.13
0.4
Freescale Semiconductor
P
5
0
0
°
°
S
°
J
D
MAX
28.10 1.098 1.106
28.10 1.098 1.106
31.40 1.220 1.236
31.40 1.220 1.236
16
3.50
0.33
0.35
0.23
0.90
0.19
7
3.85 0.132 1.106
3.85
0.38
0.30
°
S
°
0.009 0.013
0.028 0.035
0.009 0.015
0.126 0.138
0.010 0.014
0.004 0.009
0.004 0.007
0.005 0.012
0.005
0.016
MIN
0.026 REF
0.998 REF
0.013 REF
0.063 REF
0.052 REF
0.052 REF
INCHES
0
5
0
°
°
°
MAX
16
7
°
°

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