HD64F2318VTE25 Renesas Electronics America, HD64F2318VTE25 Datasheet - Page 823
HD64F2318VTE25
Manufacturer Part Number
HD64F2318VTE25
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2318VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Table 17.73 (1) Usable Area for Programming in User Program Mode
Note: * Transferring the data to the on-chip RAM enables this area to be used.
Storage Area for Program
Data
Operation for Selection of
On-Chip Program to be
Downloaded
Operation for Writing H'A5
to Key Register
Execution of Writing SC0 =
1 to FCCS (Download)
Operation for Key Register
Clear
Judgement of Download
Result
Operation for Download
Error
Operation for Settings of
Initial Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization
Error
Operation for Inhibit of
Interrupt
Operation for Writing H'5A
to Key Register
Operation for Settings of
Program Parameter
Execution of Programming
Judgement of Program
Result
Operation for Program
Error
Operation for Key Register
Clear
Item
On-Chip
RAM
Storable/Executable Area
User
MAT
× *
×
×
×
×
×
×
×
Rev.7.00 Feb. 14, 2007 page 789 of 1108
External Space
(Expanded
Mode)
×
×
×
User
MAT
—
Selected MAT
REJ09B0089-0700
Section 17 ROM
Storage Area
Embedded
Program
—
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