HD64F3687FPIV Renesas Electronics America, HD64F3687FPIV Datasheet - Page 452

MCU 3/5V 56K I-TEMP PB-FREE 64-L

HD64F3687FPIV

Manufacturer Part Number
HD64F3687FPIV
Description
MCU 3/5V 56K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3687FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3687FPIV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 23 Electrical Characteristics
Table 23.12 DC Characteristics (2)
V
Note:
Rev.5.00 Nov. 02, 2005 Page 418 of 500
REJ09B0027-0500
Item
EEPROM
current
consump-
tion
CC
= 2.7 V to 5.5 V, V
*
Symbol
I
I
I
The current consumption of the EEPROM chip is shown.
For the current consumption of H8/3687N, add the above current values to the current
consumption of H8/3687.
EEW
EER
EESTBY
Applicable Pins
V
V
V
CC
CC
CC
SS
= 0.0 V, T
a
= –20°C to +75°C, unless otherwise indicated.
Test Condition
V
V
V
s (when writing)
s (when reading)
s (at standby)
CC
CC
CC
= 5.0 V, t
= 5.0 V, t
= 5.0 V, t
SCL
SCL
SCL
= 2.5
= 2.5
= 2.5
Min
Typ
Values
Max
2.0
0.3
3.0
Unit
mA
mA
A
Notes
*

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