R5F211B4DD#ES Renesas Electronics America, R5F211B4DD#ES Datasheet - Page 3

MCU 3/5V 16K PB-FREE 20-SDIP ES

R5F211B4DD#ES

Manufacturer Part Number
R5F211B4DD#ES
Description
MCU 3/5V 16K PB-FREE 20-SDIP ES
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/R8C/Tiny/1Br
Datasheet

Specifications of R5F211B4DD#ES

Core Processor
R8C
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SIO, SSU, UART/USART
Peripherals
LED, POR, Voltage Detect, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
For Use With
R0E521174CPE10 - EMULATOR COMPACT R8C/18/19/1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
R5F211B4DD#ESR5F211B4DD#U0
Manufacturer:
Renesas Electronics America
Quantity:
135
R8C/1A Group, R8C/1B Group
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Rev.1.40
REJ03B0144-0140
1.
These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/
Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-
HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of
address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/1B Group has on-chip data flash ROM (1 KB × 2 blocks).
The difference between the R8C/1A Group and R8C/1B Group is only the presence or absence of data
flash ROM. Their peripheral functions are the same.
1.1
Electric household appliances, office equipment, housing equipment (sensors, security systems),
portable equipment, general industrial equipment, audio equipment, etc.
Overview
Applications
Dec 08, 2006
Page 1 of 45
REJ03B0144-0140
Dec 08, 2006
Rev.1.40

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