MC908AP64CFAER Freescale Semiconductor, MC908AP64CFAER Datasheet - Page 318
![IC MCU 64K FLASH 8MHZ 48-LQFP](/photos/37/62/376278/tqfp-48_sml.jpg)
MC908AP64CFAER
Manufacturer Part Number
MC908AP64CFAER
Description
IC MCU 64K FLASH 8MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet
1.MC908AP8CFBE.pdf
(324 pages)
Specifications of MC908AP64CFAER
Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, IRSCI, SCI, SPI
Peripherals
LED, LVD, POR, PWM
Number Of I /o
32
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
HC08AP
Core
HC08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908AP64E, M68CBL05CE
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC908AP64CFAER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Mechanical Specifications
23.2 48-Pin Low-Profile Quad Flat Pack (LQFP)
316
B
B1
9
AB
AC
T
12
1
4X
SECTION AE–AE
0.080
4X
0.200 AC T–U
48
13
S1
0.200 AB T–U
BASE METAL
M
A1
F
D
AC
G
A
S
T–U
N
Z
Z
Z
Z
J
37
24
AD
Figure 23-1. 48-Pin LQFP (Case #932)
MC68HC908AP Family Data Sheet, Rev. 4
36
25
U
V1
0.080 AC
DETAIL Y
V
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
4. DATUMS T, U, AND Z TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
R
Y14.5M, 1994.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE AB.
SEATING PLANE AC.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
0.0076.
DIM
AA
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
R
S
V
F
J
L
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
L °
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1°
12° REF
Freescale Semiconductor
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
5°
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