MC9S08DZ128MLF Freescale Semiconductor, MC9S08DZ128MLF Datasheet - Page 66
![MCU 8BIT 128K FLASH 48-LQFP](/photos/37/62/376254/lqfp-48_sml.jpg)
MC9S08DZ128MLF
Manufacturer Part Number
MC9S08DZ128MLF
Description
MCU 8BIT 128K FLASH 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets
1.MC9S08DV96CLF.pdf
(458 pages)
2.MC9S08DV96CLF.pdf
(4 pages)
3.MC9S08DZ128CLF.pdf
(4 pages)
Specifications of MC9S08DZ128MLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S08DZ
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
8 KB
Interface Type
CAN/I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
87
Number Of Timers
3
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
24-ch x 12-bit
Controller Family/series
HCS08
No. Of I/o's
40
Eeprom Memory Size
2KB
Ram Memory Size
8KB
Cpu Speed
40MHz
No. Of Timers
3
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
A/d Bit Size
12 bit
A/d Channels Available
16
Height
1.4 mm
Length
7 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Width
7 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DZ128MLF
Manufacturer:
ST
Quantity:
224
Company:
Part Number:
MC9S08DZ128MLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Chapter 4 Memory
4.5
The MC9S08DZ128 Series includes static RAM. The locations in RAM below 0x0100 can be accessed
using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
The RAM retains data while the MCU is in low-power wait, stop2, or stop3 mode. At power-on the
contents of RAM are uninitialized. RAM data is unaffected by any reset if the supply voltage does not drop
below the minimum value for RAM retention (V
For compatibility with M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08DZ128 Series, it is usually best to reinitialize the stack pointer to the top of the RAM so the direct
page RAM can be used for frequently accessed RAM variables and bit-addressable program variables.
Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated
to the highest address of the RAM in the Freescale Semiconductor equate file).
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or code executing from non-secure memory. See
of the security feature.
66
D7:D0
Field
7:0
Reset:
RAM
W
R
The 2s complement value written to LAPAB will be added to contents of the linear address pointer register,
LAP2:LAP0. Writing a value of 0x7f to LAPAB will increase LAP by 127, a value of 0x80 will decrease LAP by
128, and a value of 0xff will decrease LAP by 1.
LDHX
TXS
On most devices in the MC9S08DZ128 Series, more than 4K of RAM is
present in two separate address blocks.
Table 4-11. Linear Address Pointer Add Byte Register Field Descriptions
D7
0
0
7
Figure 4-10. Linear Address Pointer Add Byte Register (LAPAB)
#RamLast+1
D6
0
0
6
MC9S08DZ128 Series Data Sheet, Rev. 1
D5
;point one past RAM
;SP<-(H:X-1)
5
0
0
RAM
NOTE
D4
0
0
4
).
Description
Section 4.6.9,
D3
0
0
3
“Security”, for a detailed description
D2
0
0
2
D1
0
0
1
Freescale Semiconductor
D0
0
0
0
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