MC9S08AC16CFGE Freescale Semiconductor, MC9S08AC16CFGE Datasheet - Page 22

• Manufacturer Part Number: MC9S08AC16CFGE
• Description: IC MCU 8BIT 16K FLASH 44-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AC16CFGE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LQFP
• Package: 44LQFP
• Family Name: HCS08
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 34
• Interface Type: I2C/SCI/SPI
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 8
• Processor Series: S08AC
• Core: HCS08
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 40 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
• Minimum Operating Temperature: - 40 C
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Total Internal Ram Size: 1KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 1 Introduction
Table 1-2
1.3
Some of the modules inside the MCU have clock source choices.
connection diagram. The ICG supplies the clock sources:
22
•
ICG
ICGOUT is an output of the ICG module. It is one of the following:
— The external crystal oscillator
— An external clock source
— The output of the digitally-controlled oscillator (DCO) in the frequency-locked loop
System Clock Distribution
lists the functional versions of the on-chip modules.
sub-module
ICGERCLK
FFE
* ICGLCLK is the alternate BDC clock source for the MC9S08AC16 Series.
** XCLK is the fixed-frequency clock.
ICGLCLK*
ICGOUT
CPU
³2
CONTROL
SYSTEM
LOGIC
³2
Analog-to-Digital Converter
Internal Clock Generator
Inter-Integrated Circuit
Keyboard Interrupt
Serial Communications Interface
Serial Peripheral Interface
Timer Pulse-Width Modulator
Central Processing Unit
XCLK**
Figure 1-2. System Clock Distribution Diagram
COP
Table 1-2. Versions of On-Chip Modules
BUSCLK
MC9S08AC16 Series Data Sheet, Rev. 8
1 kHz
RTI
BDC
Module
TPM1
TPMCLK
TPM3
TPM2
(ADC)
(ICG)
(IIC)
(KBI)
(SPI)
(TPM)
(CPU)
(SCI)
IIC1
ADC has min and max
frequency requirements.
See the Electricals appendix
and the ADC chapter.
Figure 1-2
ADC1
Version
SCI1
1
2
1
4
2
4
3
3
shows a simplified clock
SCI2
RAM
Freescale Semiconductor
FLASH has frequency
requirements for program
and erase operation.
See the Electricals
appendix.
FLASH
SPI1