MC9S08SL16CTL Freescale Semiconductor, MC9S08SL16CTL Datasheet - Page 26

• Manufacturer Part Number: MC9S08SL16CTL
• Description: MCU 16KB FLASH SLIC 28TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SL16CTL

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-TSSOP
• Processor Series: S08SL
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 6
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08EL32, DEMO9S08EL32AUTO
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Package: 28TSSOP
• Family Name: HCS08
• Maximum Speed: 40 MHz
• For Use With: DEMO9S08EL32 - BOARD DEMO FOR 9S08 EL MCUDEMO9S08EL32AUTO - DEMO BOARD EL32 AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 2 Pins and Connections
2.2
Figure 2-3
application systems.
2.2.1
V
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides a regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-μF ceramic bypass capacitor located as near to the MCU power pins as
practical to suppress high-frequency noise. Each pin must have a bypass capacitor for best noise
suppression.
V
ADC module. A 0.1-μF ceramic bypass capacitor should be located as near to the MCU power pins as
practical to suppress high-frequency noise. The V
voltage reference low inputs, respectively, for the ADC module.
26
DD
DDA
V
DD
and V
Manual Reset
and V
System
Power
Background Header
Optional
Recommended System Connections
PTC2/PIC2/TPM1CH2/ADP10
PTC3/PIC3/TPM1CH3/ADP11
PTC5/PIC5/ACMP2O/ADP13
PTC0/PIC0/TPM1CH0/ADP8
PTC1/PIC1/TPM1CH1/ADP9
shows pin connections that are common to MC9S08EL32 Series and MC9S08SL16 Series
PTC6/PIC6/ACMP2+/ADP14
PTC7/PIC7/ACMP2–/ADP15
Power
SS
SSA
5 V
are the primary power supply pins for the MCU. This voltage source supplies power to all
+
are the analog power supply pins for the MCU. This voltage source supplies power to the
PTC4/PIC4/ADP12
10 μF
C
BLK
+
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
V
DD
4.7 kΩ–10 kΩ
0.1 μF
0.1 μF
0.1 μF
C
C
BY
BY
Figure 2-3. Basic System Connections
V
V
V
V
PORT
SS
DD
DDA
SSA
BKGD/MS
C
RESET
R
R
PU
/V
/V
PU
REFH
REFL
MC9S08EL32
REFH
and V
PORT
PORT
A
B
REFL
pins are the voltage reference high and
C1
PTA0/PIA0/TPM1CH0/TCLK/ACMP1+/ADP0
PTA1/PIA1/TPM2CH0/ACMP1–/ADP1
PTA2/PIA2/SDA/RxD/ACMP1O/ADP2
PTA3/PIA3/SCL/TxD/ADP3
PTA6/TPM2CH0
PTA7/TPM2CH1
PTB0/PIB0/SLRxD/RxD/ADP4
PTB1/PIB1/SLTxD/TxD/ADP5
PTB2/PIB2/SDA/SPSCK/ADP6
PTB3/PIB3/SCL/MOSI/ADP7
PTB4/TPM2CH1/MISO2
PTB5/TPM1CH1/SS
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
X1
R
F
Freescale Semiconductor
C2
R
S