MC9S08SH16CTGR Freescale Semiconductor, MC9S08SH16CTGR Datasheet - Page 315

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MC9S08SH16CTGR

Manufacturer Part Number
MC9S08SH16CTGR
Description
MCU 8BIT 16K FLASH 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08SH16CTGR

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-TSSOP
Package
16TSSOP
Family Name
HCS08
Maximum Speed
40 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
13
Interface Type
SCI/SPI
On-chip Adc
8-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08SH32 and MC9S08SH16 devices.
B.1.1
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Freescale Semiconductor
Jennifer
1
2
See
See
Device Number
MC9S08SH32
MC9S08SH16
Core
Family
- SH
Status
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Table
Table B-2
Ordering Information
Device Numbering Scheme
1-1for a complete description of modules included on each device.
for package information.
1
Figure B-1. MC9S08SH32 Device Numbering Scheme
Flash
32 K
16
MC 9
Table B-1. Device Numbering System
Memory
MC9S08SH32 Series Data Sheet, Rev. 2
S08 SH n
1024 B
1024 B
RAM
Memory Size
- 32 Kbytes
- 16 Kbytes
PRELIMINARY
28 TSSOP
28 SOIC
C
28-Pin
xx
R
Available Packages
20 TSSOP
20-Pin
Tape and Reel Suffix (optiona
- R = Tape and Reel
Package Designator
Two letter descriptor (refer to
Table
Temperature Option
- C = –40 to 85 °C
- M = –40 to 125 °C
B-2).
2
16 TSSOP
16-Pin
315

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