STM32F101ZDT6 STMicroelectronics, STM32F101ZDT6 Datasheet - Page 95
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STM32F101ZDT6
Manufacturer Part Number
STM32F101ZDT6
Description
MCU ARM 32BIT 384K FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F101RET6.pdf
(106 pages)
Specifications of STM32F101ZDT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F101ZDT6
Manufacturer:
STM
Quantity:
243
Company:
Part Number:
STM32F101ZDT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F101xC, STM32F101xD, STM32F101xE
Figure 51. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
1. Drawing is not to scale.
Table 59.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
E
b
e
F
0.8 mm pitch, package outline
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
C
0.21
0.35
9.85
9.85
Min
Seating plane
A2
A4
B
A3
millimeters
M
10.00
10.00
Doc ID 14610 Rev 7
1.07
0.27
8.80
0.40
8.80
0.80
0.60
0.10
0.15
0.08
Typ
Ball A1
e
D1
10.15
10.15
Max
1.70
0.85
0.45
D
Øb
Ø
Ø
(144 balls)
eee M C A B
fff
F
M
0.0083
0.0138
0.3878
0.3878
C
Typ
F
e
E1 E
A
Package characteristics
A
inches
ddd
0.0421
0.0106
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
0.0039
0.0059
0.0031
A1
Min
C
X3_ME
(1)
0.0669
0.0335
0.0177
0.3996
0.3996
Max
95/106