STM32F105R8T6 STMicroelectronics, STM32F105R8T6 Datasheet - Page 72

MCU ARM 64KB FLASH MEM 64-LQFP

STM32F105R8T6

Manufacturer Part Number
STM32F105R8T6
Description
MCU ARM 64KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F105R8T6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F105x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
20KB
# I/os (max)
51
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8922

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Electrical characteristics
Table 51.
1. Based on characterization, not tested in production.
2. Guaranteed by design, not tested in production.
3. V
4. For external triggers, a delay of 1/f
72/101
Symbol
t
t
CONV
STAB
t
t
latr
t
lat
S
(2)
REF+
(2)
(2)
(2)
(2)
is internally connected to V
Injection trigger conversion latency
Regular trigger conversion latency
Sampling time
Power-up time
Total conversion time (including
sampling time)
ADC characteristics (continued)
Equation 1: R
The formula above
error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 52.
1. Based on characterization, not tested in production.
1.5
7.5
13.5
28.5
41.5
55.5
71.5
239.5
R
AIN
Parameter
------------------------------------------------------------- - R
f
T
ADC
s
R
(cycles)
AIN
AIN
C
DDA
(Equation
PCLK2
ADC
max for f
max formula
T
and V
S
must be added to the latency specified in
ln
REF-
1) is used to determine the maximum external impedance allowed for an
2
ADC
N
is internally connected to V
+
Doc ID 15274 Rev 5
0.11
0.54
0.96
2.04
2.96
3.96
5.11
17.1
2
f
f
f
f
ADC
ADC
ADC
ADC
= 14 MHz
Conditions
= 14 MHz
= 14 MHz
= 14 MHz
= 14 MHz
ADC
(1)
t
S
(µs)
14 to 252 (t
successive approximation)
SSA
0.107
.
Min
1.5
0
1
Table
S
STM32F105xx, STM32F107xx
for sampling +12.5 for
51.
0.4
5.9
11.4
25.2
37.2
50
NA
NA
Typ
0
R
AIN
max (k)
0.214
0.143
239.5
Max
17.1
3
2
18
1
(4)
(4)
1/f
1/f
1/f
1/f
Unit
µs
µs
µs
µs
µs
ADC
ADC
ADC
ADC

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