STM8S105K6B6 STMicroelectronics, STM8S105K6B6 Datasheet - Page 125
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STM8S105K6B6
Manufacturer Part Number
STM8S105K6B6
Description
MCU 8BIT 32K FLASH 32-SDIP
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet
1.STM8S105C4T6.pdf
(127 pages)
Specifications of STM8S105K6B6
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-SDIP (0.400", 10.16mm)
Processor Series
STM8S10x
Core
STM8
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STICE-SYS001
For Use With
497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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STM8S105xx
Date
21-Sep-2010
Revision
10
Changes
Added
Operating
power dissipation condition for T
and added ESR and ESL data in table "general operating
conditions".
Total current consumption in halt
of I
in powerdown mode, HSI clock after wakeup in the table "total
current consumption in halt mode at V
Low power mode wakeup
MHz) for the t
Internal clock sources and timing
"HSI oscillator characteristics", replaced min and max values
of "ACC
4 concerning further characterization of results.
Functional EMS (electromagnetic
replaced with IEC 61000.
Designing hardened software to avoid noise
1000 replaced with IEC 61000.
Electromagnetic interference
with IEC61967-2.
Thermal
junction ambient temperature of LQFP32 7X7 mm from 59 °C
to 60 °C in the thermal characteristics table.
Added
Added
Table 5: Legend/abbreviations for pinout tables
state"; removed "HS", (T), and "[ ]".
Table 6: Pin description for STM8S105
footnotes to the PF4 and PD1 pins.
Table 8: I/O port hardware register
of Px_IDR from 0x00 to 0xXX.
Table 9: General hardware register
address and reset state values; updated the reset state values
of the RST_SR, CLK_SWCR, CLK_HSITRIMR,
CLK_SWIMCCR, IWDG_KR, UART2_DR, and ADC_DRx
registers; replaced reserved address "0x00 5248" with the
UART2_CR5.
Figure 40: Recommended reset pin
µF with 0.1 µF
DocID14771 Rev 10
DD(H)
Unique ID
32-lead UFQFPN package mechanical
STM8S105 FASTROM microcontroller option
HSI
at 85 °C from 20 µA to 25 µA for the condition "Flash
characteristics: Replaced the thermal resistance
conditions: added introductory text; removed low
factory calibrated parameter" and removed footnote
WU(WFI)
parameter in the table "wakeup times".
times: added first condition (0 to 16
(EMI): SAE J 1752/3 replaced
A
, replaced "C
mode: replaced max value
characteristics: In the table
susceptibility): IEC 1000
map: changed reset status
map: Standardized all
protection: replaced 0.01
DD
microcontrollers: added
= 5 V.
Revision history
problems: IEC
EXT
: updated "reset
data.
" by "VCAP",
list.
125/127
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