ST62T03CB6 STMicroelectronics, ST62T03CB6 Datasheet - Page 89

• Manufacturer Part Number: ST62T03CB6
• Description: IC MCU 8BIT W/ADC 16-PDIP
• Manufacturer: STMicroelectronics
• Series: ST6r

Specifications of ST62T03CB6

• Core Processor: ST6
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LVD, POR, WDT
• Number Of I /o: 9
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: OTP
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-DIP (0.300", 7.62mm)
• Controller Family/series: ST6
• No. Of I/o's: 9
• Ram Memory Size: 64Byte
• Cpu Speed: 8MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• Processor Series: ST62T0x
• Core: ST6
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 9
• Number Of Timers: 2
• Operating Supply Voltage: 3 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST622XC-KIT/110, ST62GP-EMU2, ST62E2XC-EPB/110, ST62E6XC-EPB/US, STREALIZER-II
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

12.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in
Figure 72. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 73. Recommended Reflow Soldering Oven Profile (MID JEDEC)
Temp. [°C]
Temp. [°C]
250
200
150
100
250
200
150
100
50
50
0
0
PREHEATING
PHASE
Figure 72
ramp up
2°C/sec for 50sec
20
90 sec at 125°C
80°C
and
100
40
Figure
SOLDERING
PHASE
73.
60
5 sec
200
150 sec above 183°C
80
Recommended glue for SMD plastic packages:
Heraeus: PD945, PD955
Loctite: 3615, 3298
100
ramp down natural
2°C/sec max
COOLING PHASE
(ROOM TEMPERATURE)
Tmax=220+/-5°C
for 25 sec
ST6200C/ST6201C/ST6203C
300
120
140
400
160
Time [sec]
Time [sec]
89/100
1