ST7FLITEU09B3 STMicroelectronics, ST7FLITEU09B3 Datasheet - Page 121

• Manufacturer Part Number: ST7FLITEU09B3
• Description: IC MCU 8BIT 2K FLASH 8-DIP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FLITEU09B3

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 5
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Processor Series: ST7FLITEUx
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: ICC
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 2
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST7FLITE-SK/RAIS, ST7FLITU0-D/RAIS, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 5 Channel
• For Use With: 497-5858 - EVAL BOARD PLAYBACK ST7FLITE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Connectivity: -
• Lead Free Status / Rohs Status: Details

ST7LITEU05 ST7LITEU09
14
14.1
Package characteristics
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com.
Package mechanical data
Figure 70. 8-lead very thin fine pitch dual flat no-lead package, package outline
INDEX AREA
(D/2 x E/2)
INDEX AREA
(D/2 x E/2)
A
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D2
D
e
b
E
L
E2
Package characteristics
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