LPC2478FET208,551 NXP Semiconductors, LPC2478FET208,551 Datasheet - Page 47
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LPC2478FET208,551
Manufacturer Part Number
LPC2478FET208,551
Description
IC ARM7 MCU 512K LCD 208-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Specifications of LPC2478FET208,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-TFBGA
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4364
935284072551
LPC2478FET208-S
935284072551
LPC2478FET208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2478FET208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2478
Product data sheet
7.26.4.4 Deep power-down mode
7.26.4.5 Power domains
the meantime, the flash wake-up timer then counts 4 MHz IRC clock cycles to make the
100 μs flash start-up time. When it times out, access to the flash will be allowed. The
customers need to reconfigure the PLL and clock dividers accordingly.
Deep power-down mode is similar to the Power-down mode, but now the on-chip
regulator that supplies power to the internal logic is also shut off. This produces the lowest
possible power consumption without removing power from the entire chip. Since the Deep
power-down mode shuts down the on-chip logic power supply, there is no register or
memory retention, and resumption of operation involves the same activities as a full chip
reset.
If power is supplied to the LPC2478 during Deep power-down mode, wake-up can be
caused by the RTC Alarm interrupt or by external Reset.
While in Deep power-down mode, external device power may be removed. In this case,
the LPC2478 will start up when external power is restored.
Essential data may be retained through Deep power-down mode (or through complete
powering off of the chip) by storing data in the Battery RAM, as long as the external power
to the VBAT pin is maintained.
The LPC2478 provides two independent power domains that allow the bulk of the device
to have power removed while maintaining operation of the RTC and the Battery RAM.
On the LPC2478, I/O pads are powered by the 3.3 V (V
V
the CPU and most of the peripherals.
Although both the I/O pad ring and the core require a 3.3 V supply, different powering
schemes can be used depending on the actual application requirements.
The first option assumes that power consumption is not a concern and the design ties the
V
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (V
a dedicated 3.3 V supply for the CPU (V
converter powered independently from the I/O pad ring enables shutting down of the I/O
pad power supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that may be used by external hardware to restore chip power
and resume operation.
DD(DCDC)(3V3)
DD(3V3)
and V
pins power the on-chip DC-to-DC converter which in turn provides power to
DD(DCDC)(3V3)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 September 2010
pins together. This approach requires only one 3.3 V power
DD(DCDC)(3V3)
Single-chip 16-bit/32-bit microcontroller
). Having the on-chip DC-DC
DD(3V3)
) pins, while the
LPC2478
© NXP B.V. 2010. All rights reserved.
DD(3V3)
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) and