LPC2103FBD48,118 NXP Semiconductors, LPC2103FBD48,118 Datasheet - Page 3
![IC ARM7 MCU FLASH 32K 48-LQFP](/photos/6/64/66484/568-48-lqfp_sot313-2_sml.jpg)
LPC2103FBD48,118
Manufacturer Part Number
LPC2103FBD48,118
Description
IC ARM7 MCU FLASH 32K 48-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2100r
Datasheet
1.LPC2102FHN48551.pdf
(37 pages)
Specifications of LPC2103FBD48,118
Core Processor
ARM7
Core Size
16/32-Bit
Speed
70MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
LPC21
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, JTAG, SPI, SSP, UART
Maximum Clock Frequency
70 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DB-LQFP48-LPC2103, MCB2103, MCB2103U, MCB2103UME, KSK-LPC2103-01, KSK-LPC2103-01PL, KSK-LPC2103-02
Development Tools By Supplier
OM10079, OM10081, OM10090
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
568-4302 - BOARD EVAL LPC210X KS2103 JLINK568-4301 - BOARD EVAL LPC210X KS2103568-4300 - BOARD EVAL LPC210X MCB2103568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2622-1013 - BOARD FOR LPC2103 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSONMCB2103 - BOARD EVAL NXP LPC2101/2101/2103
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
935280966118
LPC2103FBD48-T
LPC2103FBD48-T
LPC2103FBD48-T
LPC2103FBD48-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2103FBD48,118
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
4. Block diagram
LPC2101_02_03_4
Product data sheet
Fig 1.
3
4
3
3
4
3
4
P0[31:0]
EINT2 to
EINT0
AD0[7:0]
P0[31:0]
MAT0
MAT1
MAT2
MAT3
CAP0
CAP1
CAP2
(1) Pins shared with GPIO.
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
Block diagram
LPC2101/2102/2103
PURPOSE I/O
HIGH SPEED
CONTROLLER
GENERAL
8 kB SRAM
INTERNAL
2 kB/4 kB/
SRAM
EXTERNAL COUNTER
ARM7 local bus
CAPTURE/COMPARE
TIMER 0/TIMER 1/
TIMER 2/TIMER 3
INTERRUPTS
PURPOSE I/O
WATCHDOG
EXTERNAL
GENERAL
BOOT ROM
TIMER
ADC
ACCELERATOR
8 kB
32 kB FLASH
8 kB/16 kB/
MEMORY
TRST
Rev. 04 — 2 June 2009
ARM7TDMI-S
TMS
AHB BRIDGE
TEST/DEBUG
INTERFACE
AHB TO APB
BRIDGE
TCK
peripheral bus)
TDI
(Advanced High-performance Bus)
APB (ARM
TDO
system
clock
AMBA AHB
Single-chip 16-bit/32-bit microcontrollers
PLL
INTERFACES 0 AND 1
SERIAL INTERFACES
SYSTEM CONTROL
REAL-TIME CLOCK
I
2
UART0/UART1
C-BUS SERIAL
SPI AND SSP
XTAL1
XTAL2 V
CONTROLLER
FUNCTIONS
LPC2101/02/03
INTERRUPT
VECTORED
SYSTEM
RST
DD(3V3)
002aab814
V
SS
V
DD(1V8)
© NXP B.V. 2009. All rights reserved.
DSR1, CTS1,
RTS1, DTR1
DCD1, RI1
SCL0, SCL1
SDA0, SDA1
SCK0, SCK1
MOSI0, MOSI1
MISO0, MISO1
SSEL0, SSEL1
TXD0, TXD1
RXD0, RXD1
RTCX1
RTCX2
VBAT
(1)
(1)
(1)
(1)
(1)
3 of 37
(1)
(1)
(1)