DSPIC30F6011-20E/PF Microchip Technology, DSPIC30F6011-20E/PF Datasheet - Page 59
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DSPIC30F6011-20E/PF
Manufacturer Part Number
DSPIC30F6011-20E/PF
Description
IC DSPIC MCU/DSP 132K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F6014-20IPF.pdf
(228 pages)
3.DSPIC30F6014-20IPF.pdf
(22 pages)
4.DSPIC30F6014-20IPF.pdf
(28 pages)
Specifications of DSPIC30F6011-20E/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TQFP, 64-VQFP
For Use With
XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F601120EPF
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6011-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC CHARACTERISTICS
P9b
P10
P11
P12a
P12b
P13a
P13b
Param.
No.
T
T
T
T
T
T
T
ERA
ERA
DLY
DLY
DLY
PROG
PROG
Sym
5
6
7
AC/DC CHARACTERISTICS (CONTINUED)
Delay between PGD ↓ by programming
executive to PGD released by
programming executive
Delay between PGD released by
programming executive to first PGC ↑ of
response
Delay between clocking out response
words
Row Programming cycle time
Row Programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
0.8
0.8
15
10
5
1
1
Max
2.6
2.6
—
—
—
4
4
Units
ms
ms
ms
ms
μs
μs
μs
DS70102K-page 59
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—