PIC32MX695F512L-80I/PF Microchip Technology, PIC32MX695F512L-80I/PF Datasheet - Page 38
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PIC32MX695F512L-80I/PF
Manufacturer Part Number
PIC32MX695F512L-80I/PF
Description
IC MCU 32BIT 512KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.PIC32MX320F032H-40IPT.pdf
(66 pages)
2.PIC32MX575F256H-80IMR.pdf
(2 pages)
3.PIC32MX575F256H-80IMR.pdf
(254 pages)
4.PIC32MX575F256H-80IMR.pdf
(14 pages)
5.PIC32MX575F256H-80IPT.pdf
(240 pages)
Specifications of PIC32MX695F512L-80I/PF
Core Size
32-Bit
Program Memory Size
512KB (512K x 8)
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Controller Family/series
PIC32
Ram Memory Size
128KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
I2C, SPI, UART, USB
No. Of Pwm Channels
5
Embedded Interface Type
I2C, SPI, UART, USB
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX695F512L-80I/PF
Manufacturer:
yaskawa
Quantity:
100
Company:
Part Number:
PIC32MX695F512L-80I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC32MX695F512L-80I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC32MX5XX/6XX/7XX
2.8
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 "Oscillator
Configuration" for details).
The oscillator circuit should be placed on the same side
of the board as the device. Also, place the oscillator cir-
cuit close to the respective oscillator pins, not exceed-
ing one-half inch (12 mm) distance between them. The
load capacitors should be placed next to the oscillator
itself, on the same side of the board. Use a grounded
copper pour around the oscillator circuit to isolate them
from surrounding circuits. The grounded copper pour
should be routed directly to the MCU ground. Do not
run any signal traces or power traces inside the ground
pour. Also, if using a two-sided board, avoid any traces
on the other side of the board where the crystal is
placed. A suggested layout is shown in Figure 2-3.
FIGURE 2-3:
DS61156B-page 38
External Oscillator Pins
SUGGESTED OSCILLATOR
CIRCUIT PLACEMENT
Main Oscillator
Guard Trace
Secondary
Guard Ring
Oscillator
Preliminary
2.9
If MPLAB ICD 2, ICD 3, or REAL ICE is selected as a
debugger, it automatically initializes all of the A/D input
pins (ANx) as “digital” pins by setting all bits in the
ADPCFG register.
The bits in this register that correspond to the A/D pins
that are initialized by MPLAB ICD 2, ICD 3, or REAL
ICE, must not be cleared by the user application
firmware; otherwise, communication errors will result
between the debugger and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must clear the corresponding bits in the
ADPCFG register during initialization of the ADC
module.
When MPLAB ICD 2, ICD 3, or REAL ICE is used as a
programmer, the user application firmware must cor-
rectly configure the ADPCFG register. Automatic initial-
ization of this register is only done during debugger
operation. Failure to correctly configure the register(s)
will result in all A/D pins being recognized as analog
input pins, resulting in the port value being read as a
logic '0', which may affect user application functionality.
2.10
Unused I/O pins should not be allowed to float as
inputs. They can be configured as outputs and driven
to a logic-low state.
Alternatively, inputs can be reserved by connecting the
pin to V
the pin as an input.
SS
Configuration of Analog and
Digital Pins During ICSP
Operations
Unused I/Os
through a 1k to 10k resistor and configuring
2009 Microchip Technology Inc.