AT91M55800A-33CJ Atmel, AT91M55800A-33CJ Datasheet - Page 27

• Manufacturer Part Number: AT91M55800A-33CJ
• Description: IC ARM MCU 16BIT 176BGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91M55800A-33CJ

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, WDT
• Number Of I /o: 58
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Processor Series: AT91Mx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: EBI, SPI, USART
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 58
• Number Of Timers: 10 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91EB55
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 8 bit, 2 Channel
• Cpu Family: AT91
• Device Core: ARM7TDMI
• Device Core Size: 32b
• Frequency (max): 33MHz
• Program Memory Size: Not Required
• Total Internal Ram Size: 8KB
• # I/os (max): 58
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 176
• Package Type: BGA
• For Use With: AT91EB55 - KIT EVAL FOR ARM AT91M55800A
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Revision History
1745FS–ATARM–18-Apr-06
Doc. Rev
1745AS
1745BS
1745CS
1745DS
1745ES
1745FS
Date
Jul-01
29-Jan-02
18-Apr-02
14-Jun-05
03-Oct-05
18-Apr-06
Comments
First issue
pg. 14
pg. 19
pg. 21
pg. 22
pg. 23
pg. 3
pg. 8
pg. 9
pg. 10
pg. 16
pg. 17
pg. 18
pg. 19
Global
pg. 25
pg. 25
pg. 26
Global
page 14
page 25
page 26
Added information to section Internal Memories
Changed Table 7
Added Table 10
Added Table 11
Added section Soldering Profile
Changed Table 2
Changed FIgure 3, Block Diagram.
Changed “Peripherals” paragraph.
Changed “User Peripherals” paragraph.
Changed “Peripheral Data Controller” paragraph.
Changed “AIC” paragraph.
Changed “DAC” paragraph
Changed Table 7
New corporate format numbering
package reference TQFP changed to LQFP
added
added
new package info inserted in
Change in format introduced Chapter numbering with change to table and
figure numbering.
Section 7.4.2 ”NTRST Pin”
Figure 7-1, “Separate or Common Reset Management,”
AT91M55800A-33AI LQFP176 Sn/Pb package removed
AT91M55800A-33CI BGA 176 Sn/Pb package removed
10. ”Soldering Profile”
11. ”Ordering Information”
10.1 ”Green Package Soldering Profile”
10.2 ”BGA Soldering Profile (RoHS-compliant)”
Standard Soldering Profile section errased
info added
11. ”Ordering Information”
AT91M55800A Summary
added to chapter
Change
Request
Ref.
05-330
1745D
#2602
05-452
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