PIC18F2585-I/SP Microchip Technology, PIC18F2585-I/SP Datasheet - Page 460
PIC18F2585-I/SP
Manufacturer Part Number
PIC18F2585-I/SP
Description
IC MCU FLASH 24KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F4585-IPT.pdf
(482 pages)
4.PIC18F4585-IPT.pdf
(14 pages)
5.PIC18F4585-IPT.pdf
(8 pages)
6.PIC18F4585-IPT.pdf
(12 pages)
7.PIC18F4585-IPT.pdf
(4 pages)
8.PIC18F2585-ISP.pdf
(18 pages)
Specifications of PIC18F2585-I/SP
Core Size
8-Bit
Program Memory Size
48KB (24K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
1024Byte
Ram Memory Size
3.25KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
28
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4680 - BOARD DAUGHTER ICEPIC3DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F4585-IPT PDF datasheet #3
- PIC18F4585-IPT PDF datasheet #4
- PIC18F4585-IPT PDF datasheet #5
- PIC18F4585-IPT PDF datasheet #6
- PIC18F4585-IPT PDF datasheet #7
- PIC18F2585-ISP PDF datasheet #8
- Current page: 460 of 482
- Download datasheet (9Mb)
PIC18F2585/2680/4585/4680
DS39625C-page 458
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
Preliminary
φ
E1
Units
D1
L
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
NOTE 2
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
© 2007 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
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