PIC18F2585-I/SP Microchip Technology, PIC18F2585-I/SP Datasheet - Page 459
![IC MCU FLASH 24KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F2585-I/SP
Manufacturer Part Number
PIC18F2585-I/SP
Description
IC MCU FLASH 24KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F4585-IPT.pdf
(482 pages)
4.PIC18F4585-IPT.pdf
(14 pages)
5.PIC18F4585-IPT.pdf
(8 pages)
6.PIC18F4585-IPT.pdf
(12 pages)
7.PIC18F4585-IPT.pdf
(4 pages)
8.PIC18F2585-ISP.pdf
(18 pages)
Specifications of PIC18F2585-I/SP
Core Size
8-Bit
Program Memory Size
48KB (24K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
1024Byte
Ram Memory Size
3.25KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
28
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4680 - BOARD DAUGHTER ICEPIC3DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F4585-IPT PDF datasheet #3
- PIC18F4585-IPT PDF datasheet #4
- PIC18F4585-IPT PDF datasheet #5
- PIC18F4585-IPT PDF datasheet #6
- PIC18F4585-IPT PDF datasheet #7
- PIC18F2585-ISP PDF datasheet #8
- Current page: 459 of 482
- Download datasheet (9Mb)
© 2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
PIC18F2585/2680/4585/4680
Dimension Limits
Preliminary
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
DS39625C-page 457
c
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