DSPIC33FJ64MC710-E/PF Microchip Technology, DSPIC33FJ64MC710-E/PF Datasheet - Page 2
![IC DSPIC MCU/DSP 64K 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
DSPIC33FJ64MC710-E/PF
Manufacturer Part Number
DSPIC33FJ64MC710-E/PF
Description
IC DSPIC MCU/DSP 64K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.MA330013.pdf
(370 pages)
2.PIC24HJ12GP201-ISO.pdf
(84 pages)
3.DSPIC33FJ64MC506-IPT.pdf
(340 pages)
4.DSPIC33FJ64MC506-IPT.pdf
(30 pages)
Specifications of DSPIC33FJ64MC710-E/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-TQFP, 100-VQFP
For Use With
MA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
TABLE 1:
TABLE 2:
DS80447D-page 2
dsPIC33FJ256MC510
dsPIC33FJ256MC710
Note 1:
Note 1:
Doze Mode
Compare
Module
Output
ECAN
ECAN
ECAN
I
ADC
ADC
CPU
CPU
ADC
2
SPI
SPI
SPI
C™
2:
The Device and Revision IDs (DEVID and DEVREV) are located at the last two implemented addresses in
program memory.
Refer to the “dsPIC33F/PIC24H Flash Programming Specification” (DS70152) for detailed information on
Device and Revision IDs for your specific device.
Only those issues indicated in the last column apply to the current silicon revision.
Part Number
Frame Master
Transmission
Transmission
Bus Collision
Slave Select
12-bit Mode
10-bit Mode
PWM Mode
Sleep Mode
Instruction
Instruction
SILICON DEVREV VALUES (CONTINUED)
SILICON ISSUE SUMMARY
Loopback
Sampling
Feature
Mode
Mode
EXCH
DISI
Data
Data
—
Number
Item
10.
12.
13.
14.
11.
1.
2.
3.
4.
5.
6.
7.
8.
9.
When Doze mode is enabled, any writes to a peripheral SFR
can cause other updates to that register to cease to function
for the duration of the current CPU clock cycle.
For this revision of silicon, the 12-bit ADC module INL, DNL
and signal acquisition time parameters are not within the
published data sheet specifications.
For this revision of silicon, the 10-bit ADC module DNL,
conversion speed, and signal acquisition time parameters are
not within the published data sheet specifications.
The EXCH instruction does not execute correctly.
The DISI instruction will not disable interrupts if a DISI
instruction is executed in the same instruction cycle that the
DISI counter decrements to zero.
The output compare module will miss one compare event
when the duty cycle register value is updated from 0x0000 to
0x0001.
The SPI module will fail to generate frame synchronization
pulses in Frame Master mode.
The SPI module slave select functionality will not work
correctly.
The SMP bit does not have any effect when the SPI module is
configured for a 1:1 prescale factor in Master mode.
ECAN transmissions may be incorrect if any buffers other than
Buffer 0 are enabled as transmit buffers.
Under specific conditions, the first five bits of a transmitted
identifier may not match the value in the transmit buffer ID
register.
The ECAN module (ECAN1 or ECAN2) does not function
correctly in Loopback mode.
The Bus Collision Status bit does not get set when a bus
collision occurs during a Restart or Stop event.
ADC event triggers from the INT0 pin will not wake-up the
device from Sleep or Idle mode if the SMPI bits are non-zero.
Device ID
0x00BF
0x00B7
(1)
Issue Summary
Revision ID for Silicon Revision
0x3002
A2
© 2010 Microchip Technology Inc.
0x3004
A3
Revisions
A2 A3 A4
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Affected
0x3040
A4
X
X
X
X
X
X
X
X
X
X
X
X
X
X
(2)
X
(1)
X
X
X
X
X
X
X
X
X
X
X
X
X