PIC16F874-20I/PQ Microchip Technology, PIC16F874-20I/PQ Datasheet - Page 194
![IC MCU FLASH 4KX14 EE 44-MQFP](/photos/6/59/65984/150-44-pqfp_sml.jpg)
PIC16F874-20I/PQ
Manufacturer Part Number
PIC16F874-20I/PQ
Description
IC MCU FLASH 4KX14 EE 44-MQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F873-04SO.pdf
(218 pages)
4.PIC16F873-04SO.pdf
(5 pages)
5.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F874-20I/PQ
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Oscillator Type
External
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
44-MQFP, 44-PQFP
Controller Family/series
PIC16F
No. Of I/o's
33
Eeprom Memory Size
128Byte
Ram Memory Size
192Byte
Cpu Speed
20MHz
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F874-20I/PQ
Manufacturer:
IDT
Quantity:
1 145
Company:
Part Number:
PIC16F874-20I/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16F87X
28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
DS30292C-page 192
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
D
n
p
A
E
h
L
B
c
2
1
D
L
MIN
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
2001 Microchip Technology Inc.
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8