DSPIC30F2023-30I/ML Microchip Technology, DSPIC30F2023-30I/ML Datasheet - Page 270

• Manufacturer Part Number: DSPIC30F2023-30I/ML
• Description: IC DSPIC MCU/DSP 12K 44QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2023-30I/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 35
• Flash Memory Size: 12KB
• Supply Voltage Range: 3V To 5.5V
• Operating Temperature Range: -40°C To +85°C
• Package: 44QFN EP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 35
• Interface Type: I2C/SPI/UART
• On-chip Adc: 12-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC30F1010/202X
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body (QFN-S)
With 0.40 mm Contact Length
DS70178C-page 268
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
Dimension Limits
A1
2
1
Preliminary
EXPOSED
E
A
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
NOTE 1
Units
PAD
A1
A3
E2
D2
E2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
—
D2
MAX
1.00
0.05
4.70
4.70
0.43
0.50
© 2006 Microchip Technology Inc.
—
L
b
e
K