PIC18C442-I/PT Microchip Technology, PIC18C442-I/PT Datasheet - Page 286
PIC18C442-I/PT
Manufacturer Part Number
PIC18C442-I/PT
Description
IC MCU OTP 8KX16 A/D 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16C770-ISO.pdf
(8 pages)
3.PIC18C242-ISO.pdf
(305 pages)
4.PIC18C242-ISO.pdf
(12 pages)
Specifications of PIC18C442-I/PT
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
16KB (8K x 16)
Program Memory Type
OTP
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Processor Series
PIC18C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
MSSP, SPI, I2C, PSP, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8
For Use With
I3DB18C452 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18C442-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16C770-ISO PDF datasheet #2
- PIC18C242-ISO PDF datasheet #3
- PIC18C242-ISO PDF datasheet #4
- Current page: 286 of 305
- Download datasheet (6Mb)
PIC18CXX2
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39026C-page 284
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
A1
E1
n1
E
D
B
n
p
A
L
c
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
NOM
2001 Microchip Technology Inc.
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
44
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7
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