PIC16F876A-I/SO Microchip Technology, PIC16F876A-I/SO Datasheet - Page 219
![IC MCU FLASH 8KX14 EE 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F876A-I/SO
Manufacturer Part Number
PIC16F876A-I/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873A-ISO.pdf
(234 pages)
5.PIC16F873A-ISO.pdf
(6 pages)
6.PIC16F873A-ISO.pdf
(4 pages)
7.PIC16F873A-ISO.pdf
(6 pages)
8.PIC16F873A-ISO.pdf
(4 pages)
9.PIC16F873A-ISO.pdf
(22 pages)
Specifications of PIC16F876A-I/SO
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
CCP, I2C, MSSP, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
PIC16F876AI/SO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876A-I/SO
Manufacturer:
IDT
Quantity:
201
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
2003 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
B
c
p
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
L
c
2
1
MIN
L
.068
.064
.002
.299
.396
.022
.004
.010
.201
D
0
0
0
INCHES
A1
NOM
.026
.073
.068
.006
.309
.207
.402
.030
.007
.013
A
28
4
5
5
MAX
.078
.072
.010
.319
.212
.407
.037
.010
.015
10
10
8
MIN
10.06
1.73
1.63
0.05
7.59
0.56
0.10
0.00
0.25
5.11
0
0
MILLIMETERS*
PIC16F87XA
NOM
101.60
10.20
0.65
1.85
1.73
0.15
7.85
5.25
0.75
0.18
0.32
28
5
5
MAX
DS39582B-page 217
203.20
10.34
A2
1.98
1.83
0.25
8.10
5.38
0.94
0.25
0.38
10
10