PIC16C622-20E/SS Microchip Technology, PIC16C622-20E/SS Datasheet - Page 116
![IC MCU OTP 2KX14 COMP 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16C622-20E/SS
Manufacturer Part Number
PIC16C622-20E/SS
Description
IC MCU OTP 2KX14 COMP 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C622-20E/SS
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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PIC16C62X
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS30235J-page 114
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
β
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
α
β
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
2003 Microchip Technology Inc.
NOM
p
22.80
6.35
2.54
3.94
3.30
7.94
3.30
0.29
1.46
0.46
9.40
α
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15
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