PIC24FJ64GB002-I/ML Microchip Technology, PIC24FJ64GB002-I/ML Datasheet - Page 304

IC MCU 16BIT 64KB FLASH 28QFN

PIC24FJ64GB002-I/ML

Manufacturer Part Number
PIC24FJ64GB002-I/ML
Description
IC MCU 16BIT 64KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr

Specifications of PIC24FJ64GB002-I/ML

Program Memory Type
FLASH
Program Memory Size
64KB (22K x 24)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
19
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/IrDA/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
19
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
9-ch x 10-bit
Controller Family/series
PIC24
Ram Memory Size
8KB
Cpu Speed
32MHz
No. Of Timers
5
Embedded Interface Type
I2C, LIN, SPI, UART, USB
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24FJ64GB002-I/ML
Manufacturer:
ANAREN
Quantity:
5 000
PIC24FJ64GB004 FAMILY
29.1
FIGURE 29-1:
TABLE 29-1:
TABLE 29-2:
DS39940C-page 302
PIC24FJ64GB004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance; Theta-
= Σ ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
When the voltage regulator is disabled, V
V
x (I
DD
DDCORE
3.00V
2.75V
2.50V
2.35V
2.00V
PIC24FJ64GB004 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
≤ V
Rating
OH
DD
OH
)
16 MHz
) + Σ (V
≤ 3.6V.
OL
x I
PIC24FJ64GB004 Family
OL
Preliminary
)
Frequency
MAX
JA
DD
= (45.7 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
A
D
J
must be maintained so that
33.7
39.3
Min
Typ
-40
-40
49
28
DDCORE
(T
© 2009 Microchip Technology Inc.
P
32 MHz
J
INT
– T
Max
– 2V) + 16 MHz.
Typ
+ P
A
)/θ
2.75V
2.35V
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W

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