DSPIC30F2020-20E/SP Microchip Technology, DSPIC30F2020-20E/SP Datasheet - Page 234
DSPIC30F2020-20E/SP
Manufacturer Part Number
DSPIC30F2020-20E/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2020-20E/SP
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Core Frequency
15MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
21
Flash Memory Size
12KB
Supply Voltage Range
3V To 5.5V
Package
28SPDIP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- AC164335 PDF datasheet
- DM300023 PDF datasheet #2
- DM300023 PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20IP PDF datasheet #5
- DSPIC30F1010-30ISO PDF datasheet #6
- DSPIC30F1010-30ISO PDF datasheet #7
- Current page: 234 of 286
- Download datasheet (5Mb)
dsPIC30F1010/202X
TABLE 21-2:
TABLE 21-3:
TABLE 21-4:
DS70178C-page 232
dsPIC30F1010/202X-30I
dsPIC30F1010/202X-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 28-pin QFN
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TQFP
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
V
V
V
V
S
Symbol
INT
P
Junction to ambient thermal resistance, Theta-ja (
Depending on operating conditions, air flow may be required for improved thermal performance.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
DD
DR
POR
VDD
I
/
O
=
=
∑
V
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
D D
(2)
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
DD
DD
V
I
D D
D D
Start Voltage
Rise Rate
Characteristic
–
–
V
∑
Rating
Characteristic
O H
I
O H
I
OH
DD
can be lowered without losing RAM data.
+
∑
V
O L
Preliminary
(3)
I
O L
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature
0.05
Min
3.0
3.0
—
—
JA
) numbers are achieved by package simulations.
Typ
V
1.5
—
—
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Max
5.5
5.5
—
—
48.3
33.7
Min
Typ
39.3
-40
-40
-40
-40
42
28
-40°C T
-40°C
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2006 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3.3V in 60 ms
- T
T
Max
Typ
A
A
A
+ P
) /
+85°C for Industrial
+125°C for Extended
I
/
O
Conditions
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
1, 2
1, 2
1, 2
1, 2
1, 2
°C
°C
°C
°C
W
W
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