PIC16F73-I/ML Microchip Technology, PIC16F73-I/ML Datasheet - Page 66

IC MCU FLASH 4KX14 A/D 28QFN

PIC16F73-I/ML

Manufacturer Part Number
PIC16F73-I/ML
Description
IC MCU FLASH 4KX14 A/D 28QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F73-I/ML

Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Oscillator Type
External
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC16F
No. Of I/o's
22
Ram Memory Size
192Byte
Cpu Speed
20MHz
No. Of Timers
3
No. Of Pwm
RoHS Compliant
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
PIC16F73I/ML
PICmicro MID-RANGE MCU FAMILY
3.4
DS31003A-page 3-16
Design Tips
Question 1:
Answer 1:
If the device you are using does not have filtering to the on-chip master clear circuit
ensure that proper external filtering is placed on the MCLR pin to remove narrow pulses. Electri-
cal Specification
Question 2:
Answer 2:
The most common reason for this is that the windowed device (JW) has not had its window cov-
ered. The background light causes the device to power-up in a different state than would typically
be seen in a device where no light is present. In most cases all the General Purpose RAM and
Special Function Registers were not initialized properly.
When my system is subjected to an environment with ESD and EMI, it oper-
ates erratically.
With JW (windowed) devices my system resets and operates properly. With
an OTP device, my system does not operate properly.
parameter 35
specifies the pulse width required to cause a reset.
1997 Microchip Technology Inc.
(Appendix
C),

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