PIC16F83-04/P Microchip Technology, PIC16F83-04/P Datasheet - Page 38
![IC MCU FLASH 512X14 EE 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F83-04/P
Manufacturer Part Number
PIC16F83-04/P
Description
IC MCU FLASH 512X14 EE 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC16LF84A-04P.pdf
(125 pages)
3.PIC16LF83-04P.pdf
(4 pages)
Specifications of PIC16F83-04/P
Core Size
8-Bit
Program Memory Size
896B (512 x 14)
Oscillator Type
External
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
36 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Operating Temperature
0°C ~ 70°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16F
No. Of I/o's
13
Eeprom Memory Size
64Byte
Ram Memory Size
36Byte
Cpu Speed
4MHz
No. Of
RoHS Compliant
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
36 B
Maximum Clock Frequency
10 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
2 V to 6 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
Data Rom Size
64 B
Height
3.3 mm
Length
22.86 mm
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
- Current page: 38 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
2.3.3
DS31002A-page 2-8
Tuning the Oscillator Circuit
Since Microchip devices have wide operating ranges (frequency, voltage, and temperature;
depending on the part and version ordered) and external components (crystals, capacitors,...),
of varying quality and manufacture; validation of operation needs to be performed to ensure that
the component selection will comply with the requirements of the application.
There are many factors that go into the selection and arrangement of these external components.
These factors include:
• amplifier gain
• desired frequency
• resonant frequency(s) of the crystal
• temperature of operation
• supply voltage range
• start-up time
• stability
• crystal life
• power consumption
• simplification of the circuit
• use of standard components
• combination which results in fewest components
1997 Microchip Technology Inc.
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