DSPIC30F2012-20E/ML Microchip Technology, DSPIC30F2012-20E/ML Datasheet - Page 166

• Manufacturer Part Number: DSPIC30F2012-20E/ML
• Description: IC DSPIC MCU/DSP 12K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2012-20E/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

dsPIC30F2011/2012/3012/3013
FIGURE 20-7:
TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS
DS70139G-page 166
AC CHARACTERISTICS
SY40
Note 1:
Param
(see Note)
Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.
Enable Band Gap
No.
2:
T
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
BGAP
0V
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
(1)
SY40
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
—
Typ
40
(2)
Max
65
Units
-40°C ≤ T
-40°C ≤ T
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13> bit
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
© 2010 Microchip Technology Inc.
Conditions
V
BGAP
Band Gap
Stable