PIC18LF25K22-I/SS Microchip Technology, PIC18LF25K22-I/SS Datasheet - Page 396
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18LF25K22-I/SS
Manufacturer Part Number
PIC18LF25K22-I/SS
Description
MCU 8BIT 32KB FLASH 3.6V 28SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Specifications of PIC18LF25K22-I/SS
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 19x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
1536Byte
Cpu Speed
64MHz
No. Of Timers
7
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
7
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF25K22-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
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PIC18(L)F2X/4XK22
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS41412D-page 396
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
POP
None
(TOS) bit bucket
None
The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
1
1
POP
GOTO
0000
Q2
No
0000
NEW
POP TOS
=
=
=
=
value
Q3
0031A2h
014332h
014332h
NEW
0000
operation
Q4
No
0110
Preliminary
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PC + 2 onto
return stack
Push Top of Return Stack
PUSH
None
(PC + 2) TOS
None
The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
1
1
PUSH
PUSH
0000
Q2
2010 Microchip Technology Inc.
0000
operation
=
=
=
=
=
Q3
No
345Ah
0126h
345Ah
0124h
0126h
0000
operation
Q4
No
0101
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