PIC16LC770-I/SS Microchip Technology, PIC16LC770-I/SS Datasheet - Page 206
![IC MCU OTP 2KX14 A/D PWM 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16LC770-I/SS
Manufacturer Part Number
PIC16LC770-I/SS
Description
IC MCU OTP 2KX14 A/D PWM 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16LC770-I/SS
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
15
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
PIC16LC770I/SS
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PIC16C717/770/771
17.7
DS41120B-page 204
20-Lead Plastic Small Outline (SO) – Wide, 300 mi (SOIC)
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-094
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
Dimension Limits
E1
E
Units
A2
E1
A1
D
A
E
L
B
n
p
h
c
2
1
MIN
D
h
L
.093
.088
.004
.394
.496
.010
.016
.009
.014
.291
0
0
0
INCHES*
NOM
.050
.099
.008
.407
.295
.504
.020
.033
.017
A1
.091
.011
A
20
12
12
4
MAX
.104
.094
.012
.420
.299
.512
.029
.050
.013
.020
15
15
8
MIN
12.60
10.01
2.36
2.24
0.10
7.39
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
2002 Microchip Technology Inc.
10.34
12.80
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
20
12
12
4
MAX
A2
10.67
13.00
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8
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