PIC18F25J10-I/SO Microchip Technology, PIC18F25J10-I/SO Datasheet - Page 322

IC PIC MCU FLASH 16KX16 28SOIC

PIC18F25J10-I/SO

Manufacturer Part Number
PIC18F25J10-I/SO
Description
IC PIC MCU FLASH 16KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F25J10-I/SO

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPI/I2C/MSSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILAC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180011 - MODULE PLUG-IN 18F25J10 28SOICAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164331 - MODULE SKT FOR 28SSOP 18F45J10
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F45J10 FAMILY
FIGURE 23-13:
TABLE 23-17: EXAMPLE SPI™ SLAVE MODE REQUIREMENTS (CKE = 1)
DS39682C-page 320
Param
70
71
71A
72
72A
73A
74
75
76
77
78
79
80
82
83
Note 1:
No.
Note:
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDI
SDIx
2:
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SS
SS
SC
SC
SC
SC
SS
SC
SC
SC
SC
SS
SC
SC
Symbol
B
DO
DO
2
Requires the use of Parameter #73A.
Only if Parameter #71A and #72A are used.
L2
Refer to Figure 23-3 for load conditions.
L2
L2
H2
H2
L2
H2
L2
H
L
H2
L2
R
F
B
R
F
DO
DO
SS
SC
SC
DI
DO
SS
DO
DI
L
H
L,
V SDOx Data Output Valid after SSx ↓ Edge
H,
L
V
H,
V,
Z SSx ↑ to SDOx Output High-Impedance
SSx ↓ to SCKx ↓ or SCKx ↑ Input
SCKx Input High Time
(Slave mode)
SCKx Input Low Time
(Slave mode)
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 T
Hold Time of SDIx Data Input to SCKx Edge
SDOx Data Output Rise Time
SDOx Data Output Fall Time
SCKx Output Rise Time (Master mode)
SCKx Output Fall Time (Master mode)
SDOx Data Output Valid after SCKx Edge
SSx ↑ after SCKx Edge
82
EXAMPLE SPI™ SLAVE MODE TIMING (CKE = 1)
70
MSb In
MSb
74
71
75, 76
Characteristic
72
bit 6 - - - - - - 1
bit 6 - - - - 1
Preliminary
Continuous
Single Byte
Continuous
Single Byte
80
LSb
LSb In
1.25 T
1.25 T
1.5 T
Min
T
100
CY
40
40
CY
10
CY
CY
CY
83
+ 40
+ 40
+ 30
+ 30
© 2007 Microchip Technology Inc.
77
Max Units Conditions
25
25
50
25
25
50
50
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Note 1)
(Note 1)
(Note 2)

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