PIC16F818T-E/SO Microchip Technology, PIC16F818T-E/SO Datasheet - Page 221

• Manufacturer Part Number: PIC16F818T-E/SO
• Description: IC PIC MCU FLASH 1KX14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F818T-E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 18-SOIC (7.5mm Width)
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

M
I
2
C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 15. Synchronous Serial Port (SSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
15.1 Introduction ..................................................................................................................15-2
15.2 Control Registers .........................................................................................................15-3
15.3 SPI Mode .....................................................................................................................15-6
15.4 SSP I
15.5 Initialization ................................................................................................................15-26
15.6 Design Tips ................................................................................................................15-28
15.7 Related Application Notes..........................................................................................15-29
15.8 Revision History .........................................................................................................15-30
Note:
Please refer to
use this module.
2
C Operation .....................................................................................................15-16
Appendix C.2
or the device data sheet to determine which devices
DS31015A page 15-1
15