PIC16F1936-E/SP Microchip Technology, PIC16F1936-E/SP Datasheet - Page 64
![IC PIC MCU FLASH 512KX14 28SPDIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F1936-E/SP
Manufacturer Part Number
PIC16F1936-E/SP
Description
IC PIC MCU FLASH 512KX14 28SPDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16LF1933-ISS.pdf
(508 pages)
3.PIC16LF1933-ISS.pdf
(46 pages)
4.PIC16F1936-ISS.pdf
(2 pages)
5.PIC16F1936-ISS.pdf
(10 pages)
6.PIC16F1936-ISS.pdf
(40 pages)
7.PIC16F1936-ISS.pdf
(30 pages)
8.PIC16F1936-ISS.pdf
(12 pages)
9.PIC16LF1934-IML.pdf
(418 pages)
Specifications of PIC16F1936-E/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART/MI2C/SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F722-ISS PDF datasheet
- PIC16LF1933-ISS PDF datasheet #2
- PIC16LF1933-ISS PDF datasheet #3
- PIC16F1936-ISS PDF datasheet #4
- PIC16F1936-ISS PDF datasheet #5
- PIC16F1936-ISS PDF datasheet #6
- PIC16F1936-ISS PDF datasheet #7
- PIC16F1936-ISS PDF datasheet #8
- PIC16LF1934-IML PDF datasheet #9
- Current page: 64 of 418
- Download datasheet (7Mb)
PIC16F193X/LF193X
3.5
Brown-out Reset is enabled by programming the
BOREN<1:0> bits in the Configuration register. The
brown-out trip point is selectable from two trip points
via the BORV bit in the Configuration register.
Between the POR and BOR, complete voltage range
coverage for execution protection can be imple-
mented.
Two bits are used to enable the BOR. When
BOREN = 11, the BOR is always enabled. When
BOREN = 10, the BOR is enabled, but disabled during
TABLE 3-4:
FIGURE 3-4:
DS41364A-page 62
Note 1: Even though this case specifically waits for the BOR, the BOR is already operating, so there is no delay in
BOR_NSLEEP (10)
BOR_SBOREN (01)
BOR_SBOREN (01)
BOR_NSLEEP (10)
BOR_OFF (00)
BOR_ON (11)
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
Config bits
Brown-Out Reset (BOR)
BOREN
startup.
Internal
Internal
Internal
Reset
Reset
Reset
BOR OPERATING MODES
V
V
V
DD
DD
DD
BROWN-OUT SITUATIONS
SBOREN
X
X
X
1
0
X
Device Mode
Preliminary
Awake
Sleep
X
X
X
X
< 64 ms
64 ms
Sleep. When BOREN = 01, the BOR is controlled by
the SBOREN bit of the BORCON register. When
BOREN = 00, the BOR is disabled.
If V
(T
tions”), the Brown-out situation will reset the device.
This will occur regardless of V
not ensured to occur if V
than parameter (T
If V
running, the chip will go back into a Brown-out Reset
and the Power-up Timer will be re-initialized. Once V
rises above V
64 ms Reset.
(1)
BOR
64 ms
64 ms
DD
BOR Mode
DD
Disabled
Disabled
Disabled
) (see Section 28.0 “Electrical Specifica-
Active
Active
Active
drops below V
falls below V
(1)
(1)
BOR
, the Power-up Timer will execute a
BOR
Operation upon
release of POR
BOR
BOR
).
Device
© 2008 Microchip Technology Inc.
DD
Waits for BOR ready
while the Power-up Timer is
Waits for BOR ready
for greater than parameter
Begins immediately
Begins immediately
Begins immediately
falls below V
V
V
V
BOR
BOR
BOR
DD
slew rate. A Reset is
Operation upon
wake- up from
BOR
Device
Sleep
for more
(1)
DD
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