PIC16F688-I/STG Microchip Technology, PIC16F688-I/STG Datasheet - Page 189
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16F688-I/STG
Manufacturer Part Number
PIC16F688-I/STG
Description
IC PIC MCU FLASH 4KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(204 pages)
3.PIC16F688T-ISL.pdf
(6 pages)
4.PIC16F688T-ISL.pdf
(4 pages)
5.PIC16F688T-ISL.pdf
(688 pages)
Specifications of PIC16F688-I/STG
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
14-TSSOP
For Use With
XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOPAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F688T-ISL PDF datasheet #3
- PIC16F688T-ISL PDF datasheet #4
- PIC16F688T-ISL PDF datasheet #5
- Current page: 189 of 204
- Download datasheet (4Mb)
© 2009 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
D
N
A
E
α
e
h
L
φ
c
b
β
A2
E
MIN
1.25
0.10
0.25
0.40
0.17
0.31
φ
0°
5°
5°
–
L
MILLMETERS
h
8.65 BSC
1.27 BSC
6.00 BSC
3.90 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
PIC16F688
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
DS41203E-page 187
α
c
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