PIC12F609-I/MF Microchip Technology, PIC12F609-I/MF Datasheet - Page 154

• Manufacturer Part Number: PIC12F609-I/MF
• Description: IC PIC MCU FLASH 1KX14 8-DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F609-I/MF

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC12
• No. Of I/o's: 5
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• No. Of Pwm: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFN
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC12F609/615/617/12HV609/615
16.9
DS41302D-page 154
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
*
Thermal Considerations


T
PD
P
P
P
These parameters are characterized but not tested.
I
T
DD
JA
JC
A
DIE
INTERNAL
I
DER
/
O
= Ambient temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C  T
Characteristic
A
 +125°C
149.5*
84.6*
41.2*
39.9*
211*
150*
Typ
3.0*
60*
44*
39*
9*
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
8-pin PDIP package
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3x3mm package
8-pin DFN 4x4mm package
8-pin PDIP package
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3x3mm package
8-pin DFN 4x4mm package
PD = P
P
(NOTE 1)
P
V
P
(NOTE 2)
OH
INTERNAL
I
DER
/
O
))
=  (I
= PD
INTERNAL
OL
= I
MAX
 2010 Microchip Technology Inc.
* V
DD
Conditions
(T
OL
+ P
x V
DIE
) +  (I
I
DD
/
O
- T
A
OH
)/
JA
* (V
DD
-