PIC16F616-E/P Microchip Technology, PIC16F616-E/P Datasheet - Page 166
![IC PIC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F616-E/P
Manufacturer Part Number
PIC16F616-E/P
Description
IC PIC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F609T-ISN.pdf
(26 pages)
2.PIC16F616T-ISL.pdf
(4 pages)
3.PIC16F616T-ISL.pdf
(214 pages)
4.PIC16F616T-ISL.pdf
(8 pages)
5.PIC16F616-ESL.pdf
(180 pages)
Specifications of PIC16F616-E/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Height
3.3 mm
Length
19.05 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC12F609T-ISN PDF datasheet
- PIC16F616T-ISL PDF datasheet #2
- PIC16F616T-ISL PDF datasheet #3
- PIC16F616T-ISL PDF datasheet #4
- PIC16F616-ESL PDF datasheet #5
- Current page: 166 of 214
- Download datasheet (4Mb)
PIC16F610/616/16HV610/616
TABLE 15-12: PIC16F616/16HV616 A/D CONVERSION REQUIREMENTS
DS41288F-page 166
Standard Operating Conditions (unless otherwise stated)
Operating temperature
AD130* T
AD131 T
AD132* T
AD133* T
AD134 T
Note 1:
Param
No.
2:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
Sym
AD
CNV
ACQ
AMP
GO
These parameters are characterized but not tested.
only and are not tested.
ADRESH and ADRESL registers may be read on the following T
See Section 9.3 “A/D Acquisition Requirements” for minimum conditions.
A/D Clock Period
A/D Internal RC
Oscillator Period
Conversion Time
(not including
Acquisition Time)
Acquisition Time
Amplifier Settling Time
Q4 to A/D Clock Start
Characteristic
-40°C ≤ T
(1)
A
≤ +125°C
Min
1.6
3.0
3.0
1.6
—
—
—
—
T
OSC
T
Typ†
OSC
11.5
6.0
4.0
/2 + T
—
—
11
—
/2
CY
Max Units
9.0
9.0
9.0
6.0
—
—
—
—
5
T
μs
μs
μs
μs
μs
μs
—
—
AD
CY
T
T
ADCS<1:0> = 11 (ADRC mode)
At V
At V
Set GO/DONE bit to new data in A/D
Result register
If the A/D clock source is selected as
RC, a time of T
A/D clock starts. This allows the SLEEP
instruction to be executed.
OSC
OSC
cycle.
DD
DD
-based, V
-based, V
= 2.5V
= 5.0V
© 2009 Microchip Technology Inc.
Conditions
REF
REF
CY
≥ 3.0V
is added before the
full range
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