PIC12F510-I/MC Microchip Technology, PIC12F510-I/MC Datasheet - Page 106

• Manufacturer Part Number: PIC12F510-I/MC
• Description: IC PIC MCU FLASH 1024X12 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F510-I/MC

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 8-DFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 38 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 38 B
• Interface Type: USB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164101, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 3 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163022 - ADAPTER UNIVERSAL PROG PIC12F5XXAC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F510/16F506
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS41268C-page 104
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
Preliminary
NOTE 2
EXPOSED PAD
Units
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
© 2007 Microchip Technology Inc.
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
–
E2
NOTE 1