C8051F707-GM Silicon Laboratories Inc, C8051F707-GM Datasheet - Page 40

• Manufacturer Part Number: C8051F707-GM
• Description: IC 8051 MCU 16K FLASH 48-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F70xr

Specifications of C8051F707-GM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Cap Sense, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: C8051F7x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SMBus, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F700DK
• Minimum Operating Temperature: - 40 C
• For Use With: 336-1635 - DEV KIT FOR C8051F700
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1606-5

C8051F70x/71x
40
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 m minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C1
C2
X1
Y1
E
Table 5.2. TQFP-48 PCB Land Pattern Dimensions
Figure 5.2. TQFP-48 PCB Land Pattern
Rev. 1.0
8.30
8.30
0.20
1.40
Min
0.50 BSC
Max
8.40
8.40
0.30
1.50