CY8CLED16P01-48LFXI Cypress Semiconductor Corp, CY8CLED16P01-48LFXI Datasheet - Page 41

• Manufacturer Part Number: CY8CLED16P01-48LFXI
• Description: IC PLC PSOC CMOS LED 16CH 48VQFN
• Manufacturer: Cypress Semiconductor Corp
• Series: PowerPSoC® CY8CLEDr

Specifications of CY8CLED16P01-48LFXI

• Core Processor: M8C
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: LED, PLC, POR, PWM, WDT
• Number Of I /o: 44
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.75 V ~ 5.25 V
• Data Converters: A/D 4x14b; D/A 4x9b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1000 - ISP 4PORT FOR CYPRESS PSOC MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

11.1 Thermal Impedances
Table 11-1. Thermal Impedances per Package
11.2 Capacitance on Crystal Pins
Table 11-2. Typical Package Capacitance on Crystal Pins
11.3 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 11-3. Solder Reflow Peak Temperature
Notes
Document Number: 001-49263 Rev. *E
11. T
12. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
13. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
J
= T
A
+ POWER ×
48 QFN
100 TQFP
100 TQFP
28 SSOP
28 SSOP
Package
Package
48 QFN
100 TQFP
28 SSOP
Package
48 QFN
[12]
θ
JA
Package Capacitance
Typical θ
94°C/W
28°C/W
50°C/W
2.8 pF
1.8 pF
3.1 pF
Minimum Peak Temperature
JA
[11]
240°C
220°C
220°C
[13]
Maximum Peak Temperature
CY8CLED16P01
260°C
260°C
260°C
Page 41 of 46
[+] Feedback
[+] Feedback